Recently, the QILSTE R&D team announced another major breakthrough in the field of high-power LED packaging technology, and successfully developed a mass-produced eutectic process technology. The eutectic process is an advanced process technology that eutectically welds high-brightness LED chips on the substrate or bracket. It replaces the traditional insulating glue or silver paste crystal bonding, which can reduce the thermal resistance of the device and improve the reliability of the device. QILSTE's breakthrough in eutectic process technology has once again enhanced QILSTE's core competitiveness in the field of LED packaging technology, making QILSTE's packaging technology a step closer to the international high-end level.
 

       The principle of the eutectic process is to use a variety of metals to melt at the eutectic temperature to form a eutectic alloy, so that the LED chip is welded on the substrate or bracket. Since the beginning of 2009, QILSTE has invested a lot of money, equipment and research and development force. Through continuous process development and improvement, it has successfully made the eutectic void rate of LED chips meet the requirements of industrialization, and the eutectic quality has reached the international advanced level. High-power LED devices using eutectic technology can meet more severe environmental requirements, and have broad application space in indoor lighting, outdoor lighting, automotive lighting and other fields.