Recently, QILSTE has taken the lead in the international LED industry to develop an optical three-dimensional (3D) packaging light source module based on polygonal surfaces, and has applied for a patent. One of the outstanding advantages of three-dimensional packaging is to develop the light-emitting element from the plane to the height, and provide higher chip integration in a smaller mounting area.
       QILSTE's 3D packaging module has 360° full-angle light-emitting characteristics. A single module can accommodate up to 240 pieces of 36mil high-power blue LED chips, and the maximum input power can reach 100W. 30W typical color temperature 3200K light efficiency reaches 65lm/W (halogen car lamp 15lm/W), color rendering index >75; the required installation area of the module is only 160mm2, and the output per unit installation area is higher than that of traditional discrete devices, COB packaging and other packaging structures 10-50 times the luminous flux. Using heat pipe heat dissipation technology, the thermal resistance is less than 1W/K, which perfectly solves the heat dissipation problem of high-density packaging. The 3D packaging module is mainly used to meet the special lighting requirements of high luminous flux in narrow spaces, such as high value-added fields such as automobile headlights, micro-projection, and industrial and mining lights. At present, this module is mainly used for debugging light distribution of automobile headlight lighting and projection equipment.